Lead-Free Soldering

Voorkant
Jasbir Bath
Springer Science & Business Media, 26 jun. 2007 - 299 pagina's
The past few years have seen major developments in soldering materials and processes for electronics assembly manufacture due to the movement from tin-lead to lead-free soldering. The removal of lead from electronics solders due to environmental considerations first developed with proposed US legislation in the early 1990s. At that time, the alternatives had not been fully explored, so a ban on the use of lead in electronic solders was put on hold. However the seed was sown for development with various projects initiated during the 1990s in Europe, the Americas, and Asia. Based on government pressures, Japan OEMs began to move to lead-free solder products from 1998 and this, combined with the European Union ROHS (Restriction of Hazardous Substances) legislation enacted in 2006, drove the global manufacture of electronics consumer products with le- free solders. From 1998 to the present, the development of lead-free solder materials and processes has progressed to such an extent that development work moving forward will typically only concentrate on lead-free solders and components rather than tin-lead solders and components. This book aims to give the latest information on development of the lead-free soldering materials and processes and identify where more work is needed. The chapters of the book describe legislation, alloys, reflow, wave, rework, reliability, backward and forward process compatibility, PCB surface finishes and PCB laminates, and standards affecting the general lead-free soldering arena.
 

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Inhoudsopgave

55 LeadFree PinThroughHole MiniPot Rework Soldering
138
LeadFree Solder Joint Reliability
145
62 General Trends
146
63 SAC Solder Joint Reliability Case Study
153
Backward and Forward Compatibility
173
72 Reliability of BGACSP Backward Compatibility
177
73 Estimation of Mixed Composition Liquidus Temperature
182
74 Chip Component and LeadFrame Component
187

26 Wetting and Solderability
58
27 PbFree Solder Mechanical Behavior and Solder Joint Reliability
62
LeadFree Surface Mount Assembly
75
33 Screen Printing Process
76
34 Component Placement
77
35 Reflow Soldering
78
36 Solder Joint Inspection and Acceptance Criteria
82
LeadFree Wave Soldering
91
42 LeadFree Wave Solder Alloy Alternatives
92
43 Wave Solder Equipment Recommendations
94
44 Process Recommendations
98
45 Solder Joint Characterization
102
46 Design Considerations
110
LeadFree Rework
117
53 LeadFree SMT Rework of BGACSP Soldered Joints
124
54 LeadFree PinThroughHole PTH Hand Solder Rework
135
75 Forward Compatibility
190
76 Press Fit Connector Interconnections
192
PCB Laminates
198
82 Types of Stress in Printed Wiring Boards
200
83 Laminate Material Test Methods
202
84 Accelerated Thermal Stress Testing
206
85 Accelerated Thermal Stress Test Methods
209
86 HATS Test Method A Case Study
212
LeadFree Board Surface Finishes
221
92 Process Overview
222
LeadFree Soldering Standards
271
103 IEC Standards
279
104 Japan JEITA Standards
280
105 Other Standards
281
Index
291
Copyright

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